CyberC 2024 (IEEE TCCC) 征稿: 第16届网络分布式计算与知识发现国际会议

CyberC 2024 (IEEE TCCC) 征稿: 第16届网络分布式计算与知识发现国际会议


主办方:IEEE计算机协会计算机通信技术委员会(TCCC) (


出版方:IEEE (EI & Explore)



  • EDAS平台在线提交:

  • 发送至邮箱:[email protected]并在题目中标明"CyberC 2024 Submission".

2024 Theme: Revolutionizing Computing and Communication in the AI Era



协办单位:IEEE TCCC(主办单位)、IEEE计算机学会(主办单位)、美国路易斯维尔大学、南京邮电大学、郑州大学、广州大学、西交利物浦大学           



会议构成:CyberC 2024包括新兴技术峰会、主题演讲、小组讨论、专题报告、博士研讨会、AI与大数据竞赛、最佳论文评选以及竞赛颁奖典礼。

  第一赛道: 人工智能、机器学习、自动化、智能化

  • AI & machine learning theory, architecture, and system
  • Soft computing, neural network, convolutional neural network, and deep learning
  • Intelligence computing, inductive learning, reasoning
  • Ensemble and evolutionary computation
  • Large scale natural language processing
  • Data analytics, social media, and web mining
  • Fuzzy set theory, fuzzy controls and systems
  • Feature engineering, feature learning, and feature fusion
  • Web computing, intelligent and knowledge based systems
  • Distributed and parallel systems & algorithms
  • Database and data mining and analytics
  • Pattern recognition and multimedia
  • Data streaming and storage, and data analytics
  • AI boundary and ethnicity challenges


  • Spectrum sensing, fusion, decision-making and allocation
  • Signaling process, PHY/link layer protocols and optimization  
  • Resource optimization, network, and distributed network computing
  • Dynamic spectrum access, spectrum sharing, spectrum management
  • AI/ML for cognitive radio network 
  • VNF/SDN (NFV, VIM, VNFs, service function chaining, network slicing, and Open Flow)
  • Quantum communications, and network computing resources
  • Quantum Computing in Disrupting the Moore’s Law
  • Application of Quantum Computing in Cyber Security
  • Quantum Computing in Large Scale AI.
  • Sensor networks, mesh networks, MIMO and 6G
  • Edge computing, IoT connectivity, and energy harvesting
  • LEO (Low Earth Orbit) satellite/HAPS (High Altitude Platform System) Communication & its scale and applications
  • LEOS/HAPS communication integration with terrestrial mobile networks
  • LEOS/HAPS communication network neliability
  • Industrial IoT, e.g., manufacturing, logistics, and supply chain
  • Industry control network, networking theory and algorithms
  • Wireless embedded sensor systems, body sensor, smart cities & security
  • Cognitive radio and Soft defined radio
  • Future generation communications and pervasive computing 
  • Peer-to-peer network computing and overlaying networks
  • Directional antenna and networking
  • FDMA/OFDMA modulations, synchronization, and power optimization
  • Security & privacy, attacking models, confidentiality & security in communications
  • Services, middleware, and multimedia on wireless networks
  • QoS, reliability, performance, and communication theory
  • Wireless network simulations, implementation, and applications


  • Parallel and distributed algorithms, resource allocation, and load-balance 
  • Public and private cloud, mobile cloud, mobility-aware cloud data/streams 
  • SOA, web services, and mobile services (software, infrastructure)
  • Cloud resource management and allocation
  • Cloud utility models and service pricing
  • New parallel/concurrent programming models for cloud computing
  • Scientific computation and other applications in the cloud
  • Mobility modeling, management and measurement for mobile clouds
  • Mobile multimedia content delivery, transferring, and migration 
  • Content delivery networks using storage clouds 
  • User experience and cyber security
  • Performance evaluation, measurement and optimization
  • Communications and network security l  Information security, software security, system security, or cryptography 
  • Cloud tools, test-bed, simulations, and experimental environments  
  • Collaborative and cooperative environments
  • Cloud QoS, autonomic, reliability, and fault-tolerance
  • Web services and internet computing
  • Web-caching, content delivery systems and data distribution systems
  • Distributed applications, modeling language, and software engineering
  • Pervasive/ubiquitous computing and intelligence
  • Hyper performance of cloud computing & latency challenges
  • ETE large scale cloud computing reliability


  • AI for computer vision and image processing
  • NLP, image, vision learning, and deep learning
  • Texture image representation and classification 
  • Image filtering and enhancement
  • Image segmentation 
  • Object detection and recognition
  • Tracking and motion analysis
  • Image synthesis, 3D reconstruction and modeling
  • Stereo vision and depth estimation
  • Face recognition and biometrics
  • Scene understanding and semantic segmentation
  • Image and video compression
  • Image and video restoration and super-resolution
  • Optical character recognition
  • Medical image analysis and processing
  • Document analysis and recognition
  • Video analysis and summarization
  • Augmented reality and virtual reality
  • Color, multispectral, and hyperspectral imaging
  • Medical image computing 
  • Sensing, representation, modeling, and registration 
  • Stereoscopic, multiview, and 3D processing 
  • Biometrics, forensics, and security 


  • NLP, lexical semantics, compositional semantics 
  • Semantic parsing, textual inference, entailment 
  • Question answering, event learning, causal and temporal relations,  
  • Knowledge mining and acquisition 
  • Text & data streaming, scalable computing, task deployments 
  • Information extraction, retrieval, and learning 
  • Multilingual and cross-lingual semantics 
  • Word sense disambiguation and induction 
  • Formal approaches to semantics 
  • Semantics in NLP applications and higher level NLP applications 
  • Text and speech processing 
  • Morphological analysis, syntactic analysis, lexical semantics, and discourse 
  • High performance computing, and intensive data networks 
  • Discourse, pragmatics, and dialogue 
  • Social media and social network analytics 
  • NLP computing security and information assurance 
  • Graph learning, mining, and opinion mining 
  • Cloud and high performance computing for big data 


  • Privacy enhancing, policy, access control, and regulation
  • Privacy with surveillance, big data, machine learning, and IoT
  • Privacy for healthcare, human-computer interaction, and other applications
  • Network security, cybersecurity risk assessment, malware analysis
  • Cryptography, cryptographic algorithm, post-quantum cryptography
  • Attacks, DDoS, ransomware, and cybersecurity attacks and detection
  • Cyber network, configuration, cloud, IoT, and wireless communications
  • Multistage attacks, data security, AI and intrusion detection
  • Risk assessment, management, and network monitoring
  • Blockchain, cryptocurrency, smart contracts, identity management, and voting
  • Blockchain applications, e.g., smart grid, healthcare, industrial control systems 
  • Cyber authentication and access control
  • Deep learning for attack behavior, prediction, and game theory
  • AI/ML and deep learning for security and privacy
  • Cybersafety and privacy, standardization, compliance and forensics


  • Metaverse architectures and metaverse computing
  • Edge/fog/cloud computing and distributed network systems for metaverse
  • Augmented reality, mixed reality, and virtual reality for Metaverse
  • Metaverse content creation, distribution, and management
  • Future communications and networking for metaverse
  • Intelligent metaverse technologies & applications
  • AI, machine learning, deep learning, and NLP for metaverse
  • Metaverse data privacy and security in AI-driven applications
  • Metaverse for conference, education, entertainment, marketing, and other applications
  • Blockchain technologies to support metaverse ownership and security
  • Digital-twins and metaverse


  • EDAS 平台在线提交:
  • 发送至邮箱:[email protected]并在题目中标明"CyberC 2024 Submission".

CyberC 2024会议论文集将由IEEE CPS出版。CyberC 2024的全文论文不能超过IEEE双栏格式的10页,而短文论文不能超过4页。请访问会议网站http://www.cyberc.org以获取准确的格式和提交指南。


CyberC 2024为作者向MDPI的Journal of Electronics 提交其扩展版本提供了一个特殊的渠道。 
特刊:AI for Wireless Communications and Security.



David Lu, AT&T, USA

Lionel Ni, Hong Kong University of Science and Technology (HKUST) - Guangzhou, China


Chih-Lin I, China Mobile, China

Yang Yang, HKUST - Guangzhou, China


Chi-Ming Chen, AT&T Labs, USA

Guangxia Xu, Guangzhou University, China

Dirk Kutscher, HKUST - Guangzhou, China


Bin Xie, InfoBeyond Technology LLC, USA

Ying Cui, HKUST - Guangzhou, China

Ning Wang, Zhengzhou University, China


Gareth Tyson, HKUST - Guangzhou, China

Vivian Ye, AT&T, USA

Fei Cao, InfoBeyond Technology, USA


Hong Xing, HKUST - Guangzhou, China

Yingbing Yu, Austin Peay State University, USA


Bin Xie, InfoBeyond Technology LLC, USA


Jianhua Tang, South China University of Technology, China

Liekang Zeng, HKUST - Guangzhou, China

Wenjie Wu, HKUST - Guangzhou, China


Bin Xie, InfoBeyond Technology LLC, USA

Yingbing Yu, Austin Peay State University, USA


Anup Kumar (Chair), University of Louisville, USA

Suryadip Chakraborty, Johnson C. Smith Univ., USA

Angelos Stefanidis, Xi’an Jiaotong-Liverpool University, China

Chih-Lin I, China Mobile, China

Yang Yang, HKUST - Guangzhou, China


Ahmed Hussain, KTH Royal Institute of Technology, Sweden

Ahmed Mahmoud Salama, The University of Arizona, USA

Ajay Kushwaha, Rungta College, India

Aniello Castiglione, University of Salerno, Italy

Anirudh Agarwal, The LNM Institute of Information Technology, Jaipur, India

Aoued Houari, University of Science and Technology Mohamed Boudiaf, Algeria

Ash Mohammad Abbas, Aligarh Muslim University, India

Basri Baba, Hasanuddin University, Indonesia

Bing He, Georgia Institute of Technology, USA

Chiara PERO, University of Salerno, Italy

Chao Lu, Southern Illinois University Carbondale, USA

David Liu, Purdue University, USA

Edward Chuah, University of Aberdeen, UK

Engineer Reza Khalilian, MUI Research Assistant and Author, RU

Fangfang Liu, ShangHai University, China

Fei Luo, East China University of Science and Technology, China

Gang Li, Deakin University, Australia

Guangyu Long, Winring Corporation Ltd., China

Han Li, University College Dublin, Ireland

Hang Yu, St. Francis Xavier University, Canada

Hua Cheng, East China University of Science and Technology, China

Hui Xiao, Central South University, China

Huanhuan Zhang, Beijing University of Posts and Telecommunications, China

Jiangtao Li, Shanghai University, China

Jie Wang, Tongji University, China

Jie Yu, National University of Defense Technology, China

Jose Neuman Souza, Federal University of Ceará, France

Joshua A. Abolarinwa, Namibia University of Science and Technology, Namibia

Juan Carlos Figueroa-García, Instituto Tecnológico de Colima, Mexico

Jun Shen, University of Wollongong, Australia

Kresnajaya Prasetia Pancakarsa, Universiti Teknologi Petronas, Malaysia

Lei Miao, Middle Tennessee State University, USA

Li Zhou, National University of Defense Technology, China

Marvy Badr, The British University in Egypt, Egypt

Marek Michalski, Poznan University of Technology, Poland

Mario DI NARDO, University of Naples "Federico II", Italy

Mehran Alidoost Nia, University of Tehran, Iran

Min Zhao, Shenzhen Academy of Aerospace Technology, China

Nibal Farman, University of Baghdad, Iraq

Ning Chen, Nanjing University, China

Ning Chen, Tianjin University, China

Noriko Etani, Kyoto University, Japan

Pampa Sadhukhan, Jadavpur University, India

Panem Charanarur, National Forensic Sciences University Tripura, India

Prabhu K. Thiruvasagam, NEC, India

Qinwei He, Global Energy Interconnection Research Institute Europe GmbH

Qing Cheng, National University of Defense Technology, China

Qingzhong Liang, China University of Geosciences, China

Rakesh Datta, Microsoft, USA

Rida Zia-ul-Mustafa, Northumbria University, United Kingdom

Rui Bian, University of Delaware, USA

Ruizhi Liao, The Chinese University of Hong Kong, Shenzhen, China

Sanjaya Kumar Sarangi, Utkal University, India

Shaomin Zhu, Tongji University, China

Shalini Puri, Manipal University Jaipur, Rajasthan, India

Shanti Verma, Princess Nora bint Abdul Rahman University, Saudi Arabia

Shin Yan (Xian Yin), Hong Kong Science and Technology Parks, Hong Kong, China

Suélia de Siqueira Rodrigues Fleury Rosa, University of Brasilia (UnB), Brazil

Udhaya Kumar Dayalan, Trane Technologies, USA

Wei Wang, Xi'an Jiaotong Liverpool University, China

Weiwei Jiang, Beijing University of Posts and Telecommunications, China

Wen Wang, Academy of Military Sciences, China

Weihao Qu, Monmouth University, USA

Wendi Feng, Beijing Information Science and Technology University, China

Xiaojie Zhu, Abu Dhabi University, United Arab Emirates

Xiaoli Zhi, Shanghai University, Taiwan

Xiang Feng, East China University of Science and Technology, China

Xi Shen, The University of Western Australia, Australia

Yaping Zhu, Tongji University, China

Yang Liu, Henan University of Technology, China

Yangming Wen, Jimei University, China

Yi Zou, South China University of Technology, China

Yong Shi, University of Kennesaw, USA

Youssouf Meddahi, University of Chlef, Algeria

Yu Zheng, Syracuse University, USA

Yuexing Li, School of Mathematics and Physics, Shijiazhuang University, China

Yuhua Liu, National University of Defense Technology, China

Yun Liu, Fujian Normal University, China

Zhang Jian, School of Information Science and Engineering, Central South University, China

Zhang Jing, Institute of Information Engineering Chinese Academy of Sciences, China

Zhenhua Li, Stony Brook University, USA

Zhuo Cheng, UNC Charlotte, USA

Abderrazak Hachani, International Telecommunication Union, USA

Deepak Mishra, University of New South Wales (UNSW) Sydney, Australia

Diyar Jamal Hamad, Politehnica University of Bucharest, Iraq

Hao Jin, Palo Alto Networks, USA

Houari Aoued, University of Northern British Columbia, British Columbia

Iickho Song, Korea Advanced Institute of Science and Technology, Korea (South)

José Neuman de Souza, Federal University of Ceará, France

Jose Neuman Souza, Federal University of Ceará, Brazil

Luigi Borzì, Politecnico di Torino, Italy

Nian Xia, Nanjing Normal University, China

Rakesh Datta, Microsoft Corporation, USA

Senthil Bogana, Meta, USA
Supriya Dubey, SRM Institute of Science and Technology, India
Wenbing Zhao, Cleveland State University, USA

Author Contacts
Email: [email protected]




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